Infrared absorbing glass wafer and method for producing same

US9057836B2 · kind B2 · utility

Assignee

• Schott AG · DE

Inventors

• Bianca Schreder · Pocking, DE
• Jochen Freund · Stadecken-Elsheim, DE
• Ute Woelfel · Bingen, DE
• Claude Martin · Poissy, FR
• Christophe Baur · Neuchâtel, CH
• Steffen Reichesl · Mehlingen, DE
• Marc Clement · Mainz, DE

Key dates

• Filing date: Mar 18, 2013
• Grant date: Jun 16, 2015
• Expiry date: Jun 3, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/8053
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A glass wafer is provided that is made of a copper ions containing phosphate or fluorophosphate glass. The glass wafer has a diameter greater than 15 centimeters and a thickness of less than 0.4 millimeters. The glass wafer has two plane-parallel surfaces at least one of which is polished.