Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects

US9057853B2 · kind B2 · utility

Assignee

• The Hong Kong University of Science and Technology

Inventors

• Hon Shing Lau · Allentown, US
• Shi-Wei Lee · Taoyuan, TW
• Matthew Ming Fai Yuen · Ottawa, CA
• Jingshen Wu · Hong Kong, CN
• Chi Chuen Lo · Hong Kong, CN
• Haibo Fan · Woodbridge, US
• Haibin Chen · Zhejiang, CN

Key dates

• Filing date: Feb 19, 2010
• Grant date: Jun 16, 2015
• Expiry date: Nov 24, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10121
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.