Semiconductor device
US9059009B2 · kind B2 · utility
7Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 25, 2012 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Dec 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor chips are disposed on an insulating substrate with conductive patterns, and a printed circuit board with metal pins is disposed above the insulating substrate with conductive patterns, with the semiconductor chips therebetween. A plurality of external lead terminals is fixed to the insulating substrate with conductive patterns, with the plurality of external lead terminals disposed adjacent to each other in parallel. Furthermore, metal foil pieces formed on front and rear surfaces of the printed circuit board with metal pins respectively so as to face each other, are disposed above the semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.