Semiconductor device having improved thermal properties
US9059128B2 · kind B2 · utility
1Cited by
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5Claims
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Key dates
| Filing date | Jan 15, 2013 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Apr 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a first heat spreader; a second heat spreader separated from the first heat spreader; a first semiconductor element on the first heat spreader and having a back face jointed to the first heat spreader; a second semiconductor element on the second heat spreader and having a back face jointed to the second heat spreader; a resin coating the first and second heat spreaders and the first and second semiconductor elements; and a reinforcing member provided across a region between the first and second heat spreaders in the resin, and having rigidity higher than rigidity of the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.