Electronic device package and packaging substrate for the same
US9059149B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2013 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Oct 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.