Leadframe pocket
US9059154B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2013 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Jul 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure and methods of manufacturing the same are disclosed. The package structure corresponds, in one example, to a transceiver module having a substrate with a pocket formed therein. The pocket is configured to receive one or multiple parts of a leadframe and helps reduce the amount of wire bonding required to connect the leadframe or components mounted thereon to traces on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.