Double microstrip transmission line having common defected ground structure and wireless circuit apparatus using the same
US9059491B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2011 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Dec 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/185
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Disclosed are a microstrip transmission line having a common defected ground structure (DGS) and a wireless circuit apparatus having the same. The microstrip transmission line realizes a common defected ground structure (DGS) and a double microstrip structure, and includes: a first dielectric layer; a first signal line pattern formed on a first surface of the first dielectric layer; a common ground conductive layer formed on a second surface of the first dielectric layer and having a defected ground structure, the first surface facing the second surface; a second dielectric layer having a first surface brought into contact with the common ground conductive layer, and facing the first dielectric layer while interposing the common ground conductive layer between the first dielectric layer and the second dielectric layer; and a second signal line pattern formed on a second surface of the second dielectric layer, the first surface facing the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.