Systems and methods for improved window mounting on an electronic device
US9060418B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2012 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Sep 17, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1656
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for improved window mounting on electronic devices are provided. A window mounting assembly can include a heat activated adhesive, such as a heat activated film (“HAF”), which can be used to secure a window to an enclosure. In some embodiments, heated air can be blown in from a bottom side of the window, which can provide better offset control in the assembly. In some embodiments, an undercut can be made in the enclosure that can act as a trap for HAF overflow. An overhang that is created by the undercut can reduce the visibility of HAF overflow from a user. In addition, the heated air that is applied to the window can create a high pressure region in an area underneath the window. The high pressure region can direct the HAF overflow away from this area and towards the undercut in the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.