Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
US9061318B2 · kind B2 · utility
47Cited by
81References
18Claims
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Key dates
| Filing date | Dec 5, 2014 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Dec 5, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0771
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.