Patent · US Active

Method and device for laser material processing of a workpiece

US9061376B2 · kind B2 · utility

0Cited by

3References

13Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Tim Hesse · Ditzingen, DE
Tobias Kaiser · Rutesheim, DE
Nicolai Speker · Pleidelsheim, DE
Tobias Haecker · Stuttgart, DE

Key dates

Filing date	Dec 7, 2012
Grant date	Jun 23, 2015
Priority date	—
Expiry date	Dec 7, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/14
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Cutting a workpiece with a laser beam includes using the laser beam to melt and/or vaporize at least a portion of the workpiece, and moving at least one of the workpiece and the laser beam relative to one another to form a cutting front on the workpiece, in which the laser beam includes either at least two different radially polarized beam portions offset relative to each along an advancing direction of the laser beam, or multiple laser beam strips extending along the advancing direction of the laser beam. Each laser beam strip has a different linear polarization direction, and the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.