Patent · US Active

Sensor element and carrier element for manufacturing a sensor

US9061454B2 · kind B2 · utility

5Cited by

10References

17Claims

0Family size

Assignee

Continental Teves AG & Co. OHG · DE

Inventors

Edmond De Volder · Sint-Niklaas, BE
Dietmar Huber · Annaberg-Buchholz, DE
Andreas Doering · Zufikon, CH
Jakob Schillinger · Gaimersheim, DE
Martin Watzlawik · Maintal, DE
Lothar Biebricher · Oberursel, DE

Key dates

Filing date	Oct 1, 2009
Grant date	Jun 23, 2015
Priority date	—
Expiry date	Feb 5, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4921
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.