Moisture-resistant package
US9061887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2012 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Jan 24, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/032
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Apparatus and method of making an improved moisture-resistant package for a MEMS device having movable parts, the package including a substrate, a translucent cover over the substrate, a seal and moisture barrier and a plurality of parallel sidewalls around the periphery of the substrate and cover. The sidewalls have ends and an area between the sidewalls, and the sidewalls separate the substrate and cover by a sufficient distance to provide clearance for the movement of the movable parts. The package is sealed using a glue layer that at least partially fills the area between the sidewalls, and lies between the ends of the sidewalls and one of the substrate or cover. The glue layer causes the substrate or cover, respectively, to adhere to the ends of the sidewalls. The glue layer and the sidewalls together prevent moisture from entering the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.