MEMS microphone
US9061889B2 · kind B2 · utility
1Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 17, 2011 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Feb 1, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS microphone has a support surface, a microphone substrate over the support surface and an assembly of a microphone membrane and spaced back electrode supported over the substrate. The substrate has an opening beneath the assembly. The interface between the support surface and the substrate comprises a plurality of discrete spaced portions. This structure provides some resilience to differential expansion and contraction that can arise during processing. The support surface can then be a different material to the substrate, for example a PCB laminate as the support surface and silicon as the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.