Curable resin composition, curable film and their cured products
US9062145B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2008 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Mar 23, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F299/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition containing a specific vinyl compound obtained by vinylation of a terminal of a bifunctional phenylene ether oligomer having a polyphenylene ether structure in a molecule and a specific bismaleimide compound having at least two maleimide groups in a molecule, a curable film comprising the above composition, a cured product obtained by curing the above composition, and a film obtained by curing the curable film. The above resin composition is excellent in curability even in the presence of oxygen, is curable at a low temperature and is capable of giving a cured product having a low dielectric constant, a low dielectric loss tangent, high heat resistance, excellent mechanical properties, excellent chemical resistance and excellent flame retardancy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.