Etching composition and method of manufacturing a display substrate using the system
US9062244B2 · kind B2 · utility
2Cited by
1References
13Claims
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Key dates
| Filing date | Jun 27, 2012 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Apr 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An etching composition and a method of manufacturing a display substrate using the etching composition are disclosed. The etching composition includes phosphoric acid (H3PO4) of about 40% by weight to about 70% by weight, nitric acid (HNO3) of about 5% by weight to about 15% by weight, acetic acid (CH3COOH) of about 5% by weight to about 20% by weight, and a remainder of water. Thus, a metal layer including copper may be stably etched.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.