Electrochemical etching apparatus
US9062389B2 · kind B2 · utility
12Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2012 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Aug 15, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01B32/186
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating etching apparatus includes a power supply to output current, and a container configured to contain an electrolyte. A cathode is coupled to the container and configured to fluidly communicate with the electrolyte. An anode is electrically connected to the output, and includes a graphene layer. A metal substrate layer is formed on the graphene layer, and is etched from the graphene layer in response to the current flowing through the anode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.