Method for laser cutting polycrystalline diamond structures
US9062505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2011 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Dec 10, 2032 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5676
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.