Gas sensor having micro-package structure and method for making the same
US9063084B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2014 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Feb 27, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A gas sensor having a micro-package structure includes a light-emitting unit, a light-receiving unit, and a signal-processing unit all deposited on a substrate, and a package body fixed to the substrate and having a chamber and a through hole. The chamber accommodates all the units and the through hole is over the substrate. Gas enters the chamber through the through hole. The light-emitting unit emits an optical signal that passes through the gas and then is received by the light-receiving unit. Then a signal-processing unit electrically connected to the light-receiving unit performs spectral analysis. Thereby, the gas sensor is advantageous for requiring low packaging costs and being compact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.