Patent · US Active

Opto-electronic device assembly

US9063306B2 · kind B2 · utility

3Cited by

18References

18Claims

0Family size

Assignee

HON HAI PRECISION INDUSTRY CO., LTD. · TW

Inventors

Terrance F. Little · Fullerton, US
Yuan-Chieh Lin · Hsinchu, TW
JUN-BIN HUANG · Taoyuan, TW
Jim Zhao · Fullerton, US
GANG PAUL CHEN · Walnut, US
Jie Zheng · Walnut, US
JI-CHAO LI · Nanhu, CN
An-Jen Yang · Irvine, US

Key dates

Filing date	Apr 8, 2013
Grant date	Jun 23, 2015
Priority date	—
Expiry date	Sep 16, 2033

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/428
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.