Optoelectronic module with flexible substrate
US9063309B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 22, 2013 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Dec 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/40
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An optoelectronic module for data communication through an optical fiber. The optoelectronic module may comprise a base, an outer cap, an inner cap, a flexible substrate, an attachment member, a moisture barrier and an optoelectronic module. The outer cap may have a first cavity and coupled with the base. A slit may be formed on the outer cap. The flexible substrate may be extended through the slit of the outer cap. The inner cap may be disposed within the first cavity. The inner cap may comprise a second cavity. The attachment member may be disposed within the first cavity and configured to attach the inner cap to the base. The moisture barrier may be disposed within the first cavity and encapsulates the attachment member. The optoelectronic component may be disposed within the second cavity and proximate to the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.