Thin glass processing using a carrier
US9063605B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2011 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Apr 5, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a display panel from a thin substrate using a carrier substrate is disclosed. The method includes depositing a bonding agent on a first surface of the thin substrate; depositing a bonding agent on a second surface of the carrier substrate; bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate opposite the first surface; and separating the processed thin substrate from the carrier substrate. The thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to that the required thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.