Performing cross-domain thermal control in a processor
US9063727B2 · kind B2 · utility
4Cited by
29References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2012 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Jun 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a processor includes a first domain with at least one core to execute instructions and a second domain coupled to the first domain and including at least one non-core circuit. These domains can operate at independent frequencies, and a power control unit coupled to the domains may include a thermal logic to cause a reduction in a frequency of the first domain responsive to occurrence of a thermal event in the second domain. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.