Stacking devices at finished package level
US9064716B2 · kind B2 · utility
0Cited by
25References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2009 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Sep 7, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment is a method and apparatus to stack devices. A first finished package level (FPL) device having a first grounded tested die (GTD) is reduced to nearly size of the first GTD. The first FPL has a first plurality of solder balls. The reduced first FPL device is attached to a first substrate to form a first device assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.