Semiconductor device
US9064846B2 · kind B2 · utility
5Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2014 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Apr 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a base plate having an upper surface on which the semiconductor element is mounted, a cooling fin disposed on a lower surface of the base plate, a jacket disposed in a sealing manner on the lower surface of the base plate, the jacket surrounding the cooling fin, and a header partition wall formed separately from the jacket and fixed to the jacket on the lower side of the cooling fin in the jacket, the header partition wall forming a header and a flow path for causing a refrigerant flow to the cooling fin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.