Non-planar inorganic optoelectronic device fabrication

US9065010B2 · kind B2 · utility

Assignees

• UNIVERSAL DISPLAY CORPORATION · US
• The Regents of the University of Michigan, Univers ity of Michigan Office of Technology Transfer · US

Inventors

• Stephen R. Forrest · Ann Arbor, US
• Jeramy D. Zimmerman · Golden, US
• Xin Xu · Ann Arbor, US
• Christopher Kyle Renshaw · Orlando, US

Key dates

• Filing date: Jun 28, 2012
• Grant date: Jun 23, 2015
• Expiry date: Jun 28, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/548

Abstract

A method of fabricating an optoelectronic device includes creating an optoelectronic structure on a first substrate. The optoelectronic structure includes a release layer and a plurality of inorganic semiconductor layers supported by the release layer. The plurality of inorganic semiconductor layers is configured to be active in operation of the optoelectronic device. The plurality of inorganic semiconductor layers are permanently attached to a second substrate, which is flexible. The plurality of inorganic semiconductor layers are released from the first substrate after the attaching step, and the second substrate is deformed to a non-planar configuration.