Light emitting diode package structure
US9065027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2014 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Jan 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A LED package structure includes a base portion, a light-emitting chip, a cup portion and an encapsulating glue. The base portion has an upper surface and a lower surface. The upper surface has a die-bonding area. The light-emitting chip emits a light with a first wavelength and is located on the die-bonding area. The cup portion is located on the base portion to surround the die-bonding area to form a recess having an opening. The encapsulating glue is filled into the recess. The encapsulating glue has a wavelength conversion material configured to convert part of the light with the first wavelength into a light with a second wavelength. The cup portion includes an electro chromic layer electrically connected to a first external power and a transmittance of the electro chromic layer is changed in accordance with an input voltage of the first external power to adjust the light-emitting profile of the light-emitting chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.