Flip-chip light emitting diode package with moisture barrier layer

US9065028B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• HOU-TE LIN · Hsinchu, TW
• CHAO-HSIUNG CHANG · Hsinchu, TW
• PIN-CHUAN CHEN · Hsinchu, TW
• LUNG-HSIN CHEN · Hsinchu, TW

Key dates

• Filing date: Dec 4, 2013
• Grant date: Jun 23, 2015
• Expiry date: Dec 4, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate.