Methods of adjustment free manufacture of focus free camera modules
US9065991B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2011 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Nov 23, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods are provided for wafer scale manufacturing camera modules without adjustment components to compensate for assembly errors and optical errors incurred within manufacturing tolerances. Camera modules are assembled in wafer arrays from arrays of image sensors, arrays of lens structures and arrays of optical trim elements. At least one of the arrays is a wafer. Lens structures are configured to provide less optical power than necessary to focus an image at infinity on image sensors without trim elements. A test performed during the wafer scale assembly of camera modules, after at least the sensor array and the lens structure array assembled, determines optical errors by identifying optical distortions and aberrations quantified in terms of optical power, astigmatism, coma, optical axis shift and optical axis reorientation deficiencies. Corresponding trim elements are configured to counteract distortions and aberrations prior to singulating useful camera modules from the array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.