Power supply enclosure and method of manufacturing the same
US9066416B2 · kind B2 · utility
1Cited by
1References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 24, 2013 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Jul 27, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49963
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a power supply enclosure and a method of manufacturing the same, the power supply enclosure is divided into an independent top cover, an independent bottom base, as well as two independent side panels. The top cover, the bottom base, and the side panels are formed by blanking. After extruded hole, punching or bending processes by using a change core method, the top cover and the bottom base were made, followed by assembling the two side panels on the two sides between the top cover and the bottom base to form the power supply enclosure group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.