Partitioned hybrid substrate for radio frequency applications
US9066424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2013 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Mar 10, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1057
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.