Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible
US9066431B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 30, 2013 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Aug 27, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This disclosure relates to a printed circuit board comprising a light-pervious insulation layer, a patterned electrically conductive layer and a light-pervious overlay. The patterned electrically conductive layer includes a first black oxide layer, a copper layer and a second black oxide layer. The copper layer includes two opposite surfaces and a plurality of inner surfaces interconnecting the two opposite surfaces of the copper layer. The first black oxide layer is formed on one of the surfaces, and the second black oxide layer is formed on the other surface and the inner surfaces. The patterned electrically conductive layer is arranged on the light-pervious insulation layer. The light-pervious overlay is arranged on the second black oxide layer. A method for manufacturing the printed circuit board is also provided in this disclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.