Thermal extraction architecture for camera heads, inspection systems, and other devices and systems
US9066446B1 · kind B1 · utility
12Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2013 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Feb 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Thermal extraction architectures for heat-generating electronic devices such as cameras or lights are disclosed. An electronic device such as a camera head may include a housing, a printed circuit board (PCB) within the housing, and a thermal extraction element positioned between the housing and PCB to transfer heat from the PCB to the housing and external environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.