Disassemblable electronic assembly with leak-inhibiting coolant capillaries

US9066460B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Thomas J. Brunschwiler · Thalwil, CH
• Evan G. Colgan · Chestnut Ridge, US
• Michael J. Ellsworth, Jr. · Poughkeepsie, US
• Werner Escher · Düsseldorf, DE
• Ingmar G. Meijer · Zürich, CH
• Stephen Paredes · Zürich, CH
• Gerd Schlottig · Thalwil, CH
• Jeffrey A. Zitz · Poughkeepsie, US

Key dates

• Filing date: Jan 17, 2013
• Grant date: Jun 23, 2015
• Expiry date: Feb 2, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K7/20772
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces.