Method for improving plating on non-conductive substrates
US9067238B2 · kind B2 · utility
1Cited by
11References
15Claims
0Family size
Inventors
Key dates
| Filing date | Jan 15, 2013 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Aug 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.