Patent · US Active

Laser cutting system for cutting a workpiece with a laser beam at a variable cutting speed

US9067281B2 · kind B2 · utility

2Cited by
6References
16Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 9, 2009
Grant dateJun 30, 2015
Priority date
Expiry dateAug 15, 2032

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B2219/45041
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

The laser cutting system for cutting a workpiece with a laser beam along a cutting line at a variable cutting speed includes a movable machining head for placing the laser beam on the respective workpiece, a user interface for specifying the respective cutting line and for specifying a minimum path accuracy of the laser beam, and a control device for controlling a movement of the machining head along the cutting line relative to the respective workpiece and for controlling a plurality of process variables of a cutting process. A second subset of the process variables comprises exclusively one or more process variables which have no influence on the power of the laser beam available for cutting. At least one process variable of the second subset can be controlled by way of the control device as a function of at least one variable control parameter.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.