Cutting device and cutting method of a liquid crystal panel
US9067327B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2011 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Dec 31, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/889
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting device and a cutting method of a liquid crystal panel are provided. The liquid crystal panel includes a first substrate and a second substrate assembled together. The cutting device of the liquid crystal panel includes a first cutting portion for cutting the first substrate and a second cutting portion for cutting the second substrate. The second cutting portion includes a support portion. The support portion is used to support the first substrate when the first cutting portion cuts the first substrate and the second cutting portion does not cut the second substrate yet. The present invention assures the cutting quality, improves the cutting efficiency and reduces the cutting cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.