Microfabricated ultrasonic transducers and related apparatus and methods

US9067779B1 · kind B1 · utility

Assignee

• Butterfly Network, Inc. · US

Inventors

• Jonathan M. Rothberg · Paradise, US
• Susan A. Alie · Stoneham, US
• Keith G. Fife · Palo Alto, US
• Nevada J. Sanchez · Guilford, US
• Tyler S. Ralston · Clinton, US

Key dates

• Filing date: Mar 2, 2015
• Grant date: Jun 30, 2015
• Expiry date: Mar 2, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1461
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.