Radiation curable resin composition, and fingerprint-resistant resin composition containing same
US9068085B2 · kind B2 · utility
13Cited by
2References
15Claims
0Family size
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Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | May 26, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A radiation-curable base resin composition and a fingerprint-resistant resin composition including the same are provided. The radiation-curable base resin composition includes a multifunctional urethane(meth)acrylate having three or more functional groups at 3 to 35 parts by weight, a bifunctional urethane(meth)acrylate at 3 to 35 parts by weight, at least one (meth)acrylic acid ester monomer selected from a monofunctional (meth)acrylic acid ester monomer and a multifunctional (meth)acrylic acid ester monomer at 20 to 60 parts by weight and a radiation polymerization initiator at 0.1 to 15 parts by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.