Electrochemical etching
US9068274B1 · kind B1 · utility
0Cited by
21References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2010 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Apr 27, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F3/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods to etch a workpiece are described. In one embodiment, a workpiece is disposed within an etchant solution having a composition comprising a dilute acid and a non-ionic surfactant. An electric field is generated within the etchant solution to cause an anisotropic etch pattern to form on a surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.