Metal liftoff tools and methods
US9070631B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2013 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Dec 5, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2203/007
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In certain embodiments the metal liftoff tool comprises an immersion tank for receiving a wafer cassette with wafers therein, the immersion tank including an inner weir, a lifting and lowering mechanism capable of raising and lowering the wafer cassette while submerged in fluid in the immersion tank, low pressure high velocity primary spray jets for stripping the metal, the primary spray jets positioned at opposing sides of the immersion tank parallel to the wafer surfaces planes, and secondary spray jets for pressure equalization force, positioned at the bottom of the immersion tank. A wafer lift insert is positioned at the bottom of the immersion tank to receive and periodically lift the wafers within the cassette.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.