Polymer thermal interface material having enhanced thermal conductivity
US9070660B2 · kind B2 · utility
15Cited by
1References
26Claims
0Family size
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Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.