Structure for interconnecting copper with low dielectric constant medium and the integration method thereof
US9070689B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2011 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Apr 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention belongs to the technical field of semiconductor devices, and discloses a structure for interconnecting a medium of low dielectric constant with copper and the integration method thereof. It includes: using a combination of copper interconnections and air gaps to reduce capacity, and a special structure to support copper conductors so as to maintain the shape of copper conductors after removing the medium. The advantage of the present invention is that it can realize the complete air gap structure without short circuit or disconnection of copper conductors as well as the complete air gap structure with long conductors, thus reducing RC delay.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.