Patent · US Active

Package for an optoelectronic semiconductor component and semiconductor component

US9070853B2 · kind B2 · utility

2Cited by

4References

14Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Frank Moellmer · Bad Abbach, DE
Markus Arzberger · Sunnyvale, US
Michael Schwind · Sinzing, DE
Thomas Hoefer · Lappersdorf, DE

Key dates

Filing date	Sep 13, 2011
Grant date	Jun 30, 2015
Priority date	—
Expiry date	Feb 8, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/0236
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A package for an optoelectronic semiconductor component is disclosed. The package includes a package body, a first connecting lead and a second connecting lead. The first connecting lead and the second connecting lead each extend in a vertical direction through the package body. A semiconductor component with such a package and a semiconductor chip are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.