Methods and systems for high bandwidth chip-to-chip communications interface
US9071476B2 · kind B2 · utility
54Cited by
4References
10Claims
0Family size
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Key dates
| Filing date | Mar 6, 2014 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Mar 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L25/0292
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Systems and methods are described for transmitting data over physical channels to provide a high bandwidth, low latency interface between integrated circuit chips with low power utilization. Communication is performed using group signaling over multiple wires using a vector signaling code, where each wire carries a low-swing signal that may take on more than two signal values.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.