Thermal flow sensor integrated circuit with low response time and high sensitivity
US9072464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2010 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Oct 21, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A thermal flow sensor integrated circuit for sensing flow in a channel based on temperature measurements, the integrated circuit having a temperature sensing element (30) on a front side of the integrated circuit arranged to face the channel, and a bond pad (60, 200) coupled electrically to the temperature sensing element, for making electrical contact off the integrated circuit, the bond pad being arranged to face away from the channel. By having the bond pad facing away from the channel, the space needed for the bond pad and any connections to it need not extend beyond the temperature sensing element and get in the way of the channel. Hence the temperature sensing element can be located closer to the channel or in the channel to enable measurements with better response time and sensitivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.