Methods for forming feedthroughs for hermetically sealed housings using powder injection molding
US9072910B2 · kind B2 · utility
15Cited by
11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2010 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Dec 4, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/6022
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.