Method for manufacturing a component by selective laser melting
US9073150B2 · kind B2 · utility
8Cited by
3References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 20, 2011 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Dec 28, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49742
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a component by selective laser melting and to provide heat treatment to the component is provided. The method includes building a heat treatment device adapted to provide a heat treatment to the component as part of the same selective laser melting for manufacturing the component and providing a heat treatment to the component by the heat treatment device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.