Patent · US Active

Alkaline-earth metal oxide-polymeric polishing pad

US9073172B2 · kind B2 · utility

1Cited by

3References

8Claims

0Family size

Assignee

Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

David B. James · Newark, US
Donna M. Alden · Bear, US
Andrew Wank · Avondale, US

Key dates

Filing date	May 11, 2012
Grant date	Jul 7, 2015
Priority date	—
Expiry date	Oct 5, 2033

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09G1/02
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The polishing pad includes a polymeric matrix, the polymeric matrix having a polishing surface. In addition, polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. The polymeric microelements have an outer surface and being fluid-filled for creating texture at the polishing surface. And alkaline-earth metal oxide-containing regions are distributed within each of the polymeric microelements and spaced to coat less than 50 percent of the outer surface of the polymeric microelements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.