Injection molding process and compositions with improved sealing characteristics for mold-in-place gaskets
US9073241B2 · kind B2 · utility
1Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2012 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Apr 13, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/265
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to liquid injection molding of a curable gasket composition to form mold-in-place gaskets. The curable gasket composition is prepared from at least an actinic radiation curable acrylic component and (meth)acrylate-functionalized silica.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.