Method and apparatus for cutting a substrate
US9073777B2 · kind B2 · utility
1Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2012 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Sep 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/371
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates includes a rotating table and a push plate. The rotating table, on which the large size substrate having formed thereon a plurality of cutting lines is mountable, includes rotating shafts at locations corresponding to the cutting lines. The push plate fixes a position of the large size substrate on the rotating table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.